By Fred D. Barlow III, Aicha Elshabini
Ceramics have been one of the first fabrics used as substrates for industrially produced electronics, and so they stay a tremendous category of packaging and interconnect fabric at the present time. such a lot on hand information regarding ceramic electronics is both outmoded or serious about their fabrics technological know-how features. The Ceramic Interconnect know-how guide is going past the conventional strategy via first surveying the original homes of ceramics after which discussing layout, processing, fabrication, and integration, in addition to packaging and interconnect applied sciences. accumulating contributions from an excellent panel of specialists, this e-book bargains an up to date assessment of contemporary ceramic electronics, from layout and fabric choice to production and implementation. starting with an summary of the advance, homes, benefits, and purposes of ceramics, insurance spans electric layout, checking out, simulation, thermomechanical layout, monitor printing, multilayer ceramics, photo-defined and photo-imaged movies, copper interconnects for ceramic substrates, and built-in passive units in ceramic substrates. It additionally deals an in depth evaluate of the skin, thermal, mechanical, and electric houses of assorted ceramics in addition to the processing of excessive- and low-temperature cofired ceramic (HTCC and LTCC) substrates. establishing new vistas and avenues of development, the Ceramic Interconnect expertise guide is the one resource for entire dialogue and research of approximately each part of ceramic interconnect know-how and purposes.
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Extra info for Ceramic Interconnect Technology Handbook
20 Military airborne communications multichip module. (Courtesy of CMAC America. ) chemically formed vias and screen-printed 125-µm (5-mil) lines and spaces. 42 silicon-to-substrate area ratio. 18 mm (125 mil) thick, including the lid. Line widths and spaces are 50 µm (2 mil) and vias are 50 µm (2 mil) in diameter. This multichip module met the needs for a rugged, low-profile design for avionics application. The choice of thick film on alumina technology using chemically formed vias and photo-patterned interconnects provided rapid prototyping, reducing the time from design to production to weeks rather than months, with costs lower than MCM-D technology.
Fm Page 17 Wednesday, December 20, 2006 11:09 AM Overview of Ceramic Interconnect Technolgy 17 selecting a conductor composition include ultimate solderability, resistance to leaching, adhesion of the fired films, suitability for wire and chip bonding, compatibility with resistor and dielectric films, line definition attainable, and resistance to aging effects upon refiring. 8 Thick-Film Dielectrics Functions of the dielectric paste include a crossover dielectric and high-K capacitors. A crossover dielectric is a low dielectric constant insulator capable of separating two conductor patterns through several firing steps with good isolation and minimum stray capacitance.
This system-in-package module uses top surface thick-film printed resistors, surface-mounted passives, and wire bonded ICs achieving a component density of over 60 components per square inch. Precision electrical tolerances are maintained over a –55 to 125°C operating temperature range. 16 Avionic display system. (Courtesy of CMAC Microcircuits Ltd. 2 Automotive Industry Early applications in the 1970s in the automotive industry used thick-film substrates in engine-compartment-mounted silicon-gel-filled, nonhermetic plastic, voltage regulator modules.