By Brajesh Kumar Kaushik, Manoj Kumar Majumder
The short basically makes a speciality of the functionality research of CNT established interconnects in present examine situation. diverse CNT constructions are modeled at the foundation of transmission line conception. functionality comparability for various CNT constructions illustrates that CNTs are extra promising than Cu or different fabrics utilized in worldwide VLSI interconnects. The short is prepared into 5 chapters which generally speak about: (1) an outline of present examine state of affairs and fundamentals of interconnects; (2) distinct crystal buildings and the fundamentals of actual homes of CNTs, and the construction, purification and purposes of CNTs; (3) a quick technical overview, the geometry and an identical RLC parameters for various unmarried and bundled CNT buildings; (4) a comparative research of crosstalk and hold up for various unmarried and bundled CNT buildings; and (5) quite a few exact combined CNT package buildings and their identical electric models.
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Additional resources for Carbon Nanotube Based VLSI Interconnects: Analysis and Design
2002; Li et al. 2009a), and passives (Li and Banerjee 2008a). The applications of CNTs in different fields are listed below. 1 Structural CNTs possesses remarkable properties and qualities as structural materials. Their potential applications include (Jorio et al. 2008): (a) Textiles—CNTs can produce waterproof and tear-resistant fabrics. (b) Body armor—CNT fibers are being used as combat jackets. The jackets are used to monitor the condition of the wearer and to provide protection from bullets.
2010). To analyze the delay performance, the virtual effects for insertion of variable number of repeaters along the interconnect and their influence on contact resistance between CNTs and external circuitry were also studied. It was observed that the reduction of delay for CNT based interconnects was not at par with Cu based interconnects for semi-global level. 7 Performance Comparison of SWNT Bundles and MWNT Interconnect Models Li and Banerjee (2009b) presented an investigation of high-frequency effects in CNT interconnects and their implications for design and performance analysis of high quality on-chip inductors.
2005). Similar to the previous assumption, Nieuwoudt and Massoud (2006b) presented an accurate and scalable model for magnetic inductance of SWNT bundles considering the density and statistical distribution for both metallic and semiconducting nanotubes within the bundle. It has been observed that both the magnetic inductance and kinetic inductance are highly dependent on the bundle geometry. Moreover, a realistic RLC model of CNT interconnect is presented in Raychowdhury and Roy (2006). The authors reported that substantial numbers of metal layers are required for modeling of CNT interconnects to meet the performance of copper in same die area.