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Download Adhesives Technology for Electronic Applications: Materials, by James J. Licari PDF

By James J. Licari

Adhesives are prevalent within the manufacture and meeting of digital circuits and items. typically, electronics layout engineers and production engineers aren't good versed in adhesives, whereas adhesion chemists have a restricted wisdom of electronics. This publication bridges those wisdom gaps and turns out to be useful to either teams.

The ebook contains chapters protecting forms of adhesive, the chemistry on which they're dependent, and their houses, purposes, tactics, necessities, and reliability. insurance of toxicity, environmental affects and the regulatory framework make this ebook rather vital for engineers and executives alike.

The 3rd version has been up to date all through and comprises new sections on nanomaterials, environmental affects and new environmentally pleasant ‘green’ adhesives. information regarding laws and compliance has been introduced totally up-to-date.

As good as supplying complete insurance of ordinary adhesive forms, Licari explores the latest advancements in fields such as:

• Tamper-proof adhesives for digital safety devices.

• Bio-compatible adhesives for implantable scientific devices.

• Electrically conductive adhesives to exchange poisonous tin-lead solders in published circuit meeting - as required by means of regulatory regimes, e.g. the EU’s limit of unsafe elements Directive or RoHS (compliance is needed for all items put on the eu market).

• Nano-fillers in adhesives, used to extend the thermal conductivity of present adhesives for cooling digital devices.

  • A whole advisor for the electronics to adhesive forms, their homes and functions - this publication is a necessary reference for a variety of experts together with electric engineers, adhesion chemists and different engineering professionals.
  • Provides requirements of adhesives for specific makes use of and descriptions the approaches for software and curing - assurance that's of specific gain to layout engineers, who're charged with growing the interface among the adhesive fabric and the microelectronic device.
  • Discusses the respective benefits and boundaries of alternative adhesives for a various purposes, thereby addressing reliability matters sooner than they happen and supplying beneficial details to either layout engineers and caliber coverage personnel.

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Additional resources for Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Example text

49 Both WLP and 3-D packaging are expected to continue to increase by eliminating or combining steps in the packaging process, thereby reducing costs. The broad field of “green” technology has already had a large impact on the materials used in formulating adhesives, on the processes used to prepare and clean surfaces and on curing adhesives. Major thrusts have already started and are expected to continue, for example: replacing toxic materials (brominated flame retardants and lead solders), reducing or eliminating organic solvents, and reducing energy consumption to alleviate global warming.

The contact angle is greater on rough surfaces compared to planar surfaces where q is greater than 90 . 3 On the other hand, slightly abraded surfaces, as for thick-film gold conductors, are necessary to improve adhesion. Thus, Eq. 3) may be modified by introducing a “contact coefficient” that is a function of surface roughness. 1 Factors affecting wettability In addition to the contact angle, surface energy, and surface-tension considerations just discussed, the degree of wetting depends on the pot life and gel time of the adhesive.

The copper is then photoetched to form a circuit pattern using normal photolithography processes. A plastic film (coverlay) is then adhesive bonded to the etched copper circuitry except that open areas are left for subsequently attaching components. The coverlay provides moisture, contaminant, and handling protection much as a conformal coating does for a PWA. Dielectric films most widely used are polyimide, for example, DuPont’s KaptonÒ H, polyester terephthalate (DuPont’s MylarÒ), epoxy polyester, and various fluoropolymers such as TeflonÒ FEP or TeflonÒ PTFE.

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